Phosphor Bronze Electrode Classification And Composition

- Jan 19, 2018 -

Phosphor Bronze electrode classification and composition

1, BCu92P: component P: 7.5-8.5%, copper: balance. Melting temperature 710-750 ℃, low melting point, the solder flow better, but more brittle, generally used for brazing without impact load, vibration-free brass and brass parts welding;

2, BCu93P (HL201 / BCuP-2): component P: 6.80-7.50%, copper: balance. Melting temperature of 710-793 ℃, the solder flow is good, can flow into the gap is very small joints, but the solder brittle, generally used in mechanical and electrical instrumentation industry, brazing from impact load of copper and brass parts;

3, BCu89SnP (HL208): component P: 6.80-7.50%, tin: 5.0-6.0%, copper: balance. Melting temperature 620-660 ℃, the solder melting point is low, good liquidity, with brazing flux brazing copper, brass, bronze and low zinc brass parts;

4, BCu86SnP: component P: 4.80-5.80%, tin: 7.00-8.00%, nickel: 0.40-1.20%, copper: balance. Melting temperature 620-670 ℃, the use of the solder ibid. Nickel added to increase the brittleness, but increased mobility, and weld bright, generally used for brazing copper and brass.

5, BCu91AgP (HL209 / BCuP-6): component P: 5.50-7.50%, silver 1.80-2.20%, copper: balance. Melting temperature 645-771 ℃, low melting point, the solder can fill the joint gap in a larger temperature range, and more for refrigerators, air conditioners, motors and instrumentation industry and other industries brazing copper and brass pieces;

6, BCu89AgP (BCuP-3): component P: 5.8-6.70%, silver 4.80-5.20%, copper: balance. Melting temperature 645-788 ℃, low melting point, the ductility and conductivity of the solder is improved, the general mobility, suitable for brazing larger copper and brass parts;

7. BCu88AgP (HL205 / BCuP-7): ingredient P: 6.50-7.00%, silver 4.80-5.20%, copper: balance. The melting temperature is 645-780 ℃, the melting point is low, the ductility and conductivity of the solder are improved, and the fluidity is better than B-Cu89PAg, which is generally used for brazing copper and brass parts with larger gaps;

8, BCu87PAg (BCuP-4): component P: 7.0-7.5%, silver 5.80-6.20%, copper: balance. The melting temperature of 645-718 ℃, low melting point, the solder melting point is low, good fluidity, brazing gap smaller joints, generally used for brazing copper and brass parts;

9. BCu80PAg (HL204 / BCuP-5): component P: 4.80-5.30%, silver 14.50-15.50%, copper: balance. Melting temperature 645-815 ℃, low melting point, the ductility and conductivity of the solder has been further improved for the welding requirements than HL205 (5% silver) solder high copper and brass joint parts gap.

10, BCu60ZnSn-R (S221 / RBCuZn-A): component copper: 59.00-61.00%, tin 0.80-1.20%, silicon: 0.15-0.35%, zinc: balance. Melting temperature 890-905 ℃, the solder melting point higher, can be used for carbide cutting tools, molds and mining tools welding. And can replace H62 solder to obtain a more dense weld, and can be used as gas welding brass wire


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